References in Automation- & Semi-Conductor Technology
Imaging Inspection Module
Imaging inspection module for ultra-fast inspection of semiconductor patterned and unpatterned wafer in size 200mm and 300mm. Full wafer surface images are processed in near real-time to extract a broad range of defects.
Production Steps by OLPE
- taking part in the construction
- purchasing of materials
- serial production of the module according to customer‘s specifications