References in Automation- & Semi-Conductor Technology

Imaging Inspection Module



Imaging inspection module for ultra-fast inspection of semiconductor patterned and unpatterned wafer in size 200mm and 300mm. Full wafer surface images are processed in near real-time to extract a broad range of defects.

Production Steps by OLPE

  • taking part in the construction
  • purchasing of materials
  • serial production of the module according to customer‘s specifications
  • logistics